Lead-Free Solder Joint Reliability

סוג הפעילות

סמינר

מועד הפעילות

19/05/08 - 20/05/08

מקום הפעילות

Daniel Hotel, Herzliaמפה מצורפת

תיאור המפגש

This seminar provides an extensive coverage of lead-free attachment reliability issues and trends and offers practical guidelines to assess the reliability of lead-free solder joints and circuit board assemblies.   Participants will gain an in-depth understanding of the multitude of material, design and manufacturing parameters that affect solder joint reliability and that are critical to the deployment of lead-free circuit board assemblies. Following a review of the basics of solder joint mechanics, test procedures, failure modes and mechanisms, the seminar puts in perspective a wide range of lead-free data, material properties, test and modeling results from across the industry. Test results are discussed for common components (leadless, leaded, BGA, Flip-Chip, CSPs), including the effect of board and component finish on lead-free reliability, and a comparison of tin-lead, mixed assemblies and lead-free reliability data. Metallurgical risks, creep properties and fatigue curves are examined that explain differences in the reliability of tin-lead and lead-free assemblies.  Examples of strain-energy based life prediction models and acceleration factors are presented, comparing test efficiency for SAC and SnPb assemblies and illustrating techniques to extrapolate lead-free test results to product use conditions, the true measure of lead-free assembly reliability.  

The tutorial is technical in nature and pulls together a wide range of data, material properties, test and modeling results from across the industry. Lessons learned from the tin-lead experience and fundamental differences between SnPb and lead-free solders are highlighted as well as recent progress in the practical understanding of lead-free solder joint reliability.  Pre-requisites: none although some basic understanding of the mechanical behavior of materials is helpful.  In addition to the printed seminar hand-out, participants will receive the .pdf version of an extensive reference list on SnPb and lead-free solder joint reliability

סדר היום:

Day 1: MAY 19, 2008

  

 

08:45-09:00

Welcome

09:00-10:00

Introduction; Reliability Issues and Trends

10:00-11:00

Reliability Issues and Trends (continued)

11:00-11:15

Coffee Break

11:15-12:00

Lead-free material issues

12:00-12:45

Reliability of SMT leadless assemblies

12:45-13:45

Lunch Break

13:45-14:30

Reliability of Leaded Assemblies

14:30-15:15

Lead-Free Area Array Reliability: BGAs

15:15-15:30

Refreshments

15:30-16:15

Lead-Free Area Array Reliability: Flip-Chip

16:15-17:00

Lead-Free Area Array Reliability: CSP

17:00-17:15

Q&A

 

Day 2: May 20, 2008

  

08:45-09:00

Welcome

09:00-10:00

Lead-free solder material properties: General

10:00-11:00

- continued

11:00-11:15

Coffee Break

11:15-12:00

Lead-free solder material properties: Creep

12:00-12:45

- continued

12:45-13:45

Lunch Break

13:45-14:30

Modeling, thermal cycling, acceleration factors

14:30-15:15

-continued

15:15-15:30

Refreshments

15:30-16:15

Case studies (thermal + vibration)

16:15-17:00

- continued + discussion, Q&A

17:00-17:15

Q&A

קהל יעד

Design, materials, manufacturing, quality or reliability professionals and managers who are responsible for, or plan to implement  lead-free assembly technologies in their companies’ products