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3rd Annual
Conference on Microelectronics and Packaging
Call for Papers:
IMAPS-ISRAEL 2003
Herzelia -
Wednesday June 18, 2003
The 3rd annual conference on microelectronics
packaging will be held at the Daniel Hotel, Herzelia. It is sponsored by
the international microelectronics and packaging society (IMAPS USA).
The technical committee seeks original
papers that demonstrate how new technologies and applications are expanding
and redefining the international role of microelectronics.
All abstracts submitted must represent
original work, abstracts can be in English or Hebrew.
Organizing Committee:
Abstracts:
Abstract cut-off date:
March 10, 2003
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Notice of Acceptance:
April 14, 2003
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Final manuscripts or presentation
slides due:
May 15, 2003 Final
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Being sought for, but not limited to, the
following subjects:
Mobile Electronics
Multichip Modules
Polymeric Materials
Power Packaging
Printed Wiring Boards
Programs in Mexican Maquiladoras
Satellite Communications
Sensors, Actuators, MEMS
Surface Mount Technology
Thick Film Materials
Thin Film Materials
Wireless PackagingMobile |
Applications
Automotive Electronics
Ball Grid Array Packages
Chip Scale Packages
Flex Circuits
HDTV
High Density Packaging
Intelligent Transportation
Laser Processing
Management & Marketing
Medical Electronics
Microwave PackagingApplications |
Design, Modeling, Simulation (Reliability,
Thermal Management)
Interconnects, Bonding (Flip Chip, Wire
Bonding)
To submit a paper:
Send your 300 word abstract by March
10, 2003. Your abstract must clearly describe the nature, scope, content,
organization, key points and significance of the proposed paper. The paper
must consist of original work or results. Submission of an abstract represents
a commitment to submit a cleared manuscript by May 15, 2003. It
also represents a commitment to attend the conference A special, reduced
registration fee is offered to speakers and session chairs. It is the author's
responsibility to obtain internal company approvals consistent with the
above terms and stated deadlines.
Authors will be notified of paper
acceptance by April 14, 2003. Final manuscripts or presentation slides
for publication are due May 15, 2003. IMAPS reserves the right to
reject any manuscript for failure to comply with publication guidelines.
Camera-ready manuscripts are limited to six (6) pages, including diagrams,
figures, and photographs. The language for the conference and its publications
is English or Hebrew. Papers published in the proceedings are eligible
for publication in the IMAPS international Journal of Microcircuits &
Electronic packaging after peer review.
To submit an Abstract:
Please submit your 300-word abstract electronically
by March 10, 2003, using this submission
form, or directly to the conference's Israeli office
imaps_il@iltam.org
If you have questions or are having problems
with the on-line submittal form, please email
Moshe at imaps_il@iltam.org or call (03)
5118112.
Expression of
Interest Form
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