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3rd Annual
Conference
on Microelectronics and Packaging
General Chair:
Uri
Barneah
Foreword
The 3rd annual conference on microelectronics packaging will be held at
the Daniel Hotel, Herzelia.
It is sponsored by the international microelectronics and packaging
society (IMAPS USA).
The technical committee seeks original papers that demonstrate how
new technologies and
applications are expanding and redefining the international role of
microelectronics.
All abstracts submitted must represent original work, abstracts can
be in English or Hebrew.
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